LEPA LPALV12 Cooling Fan/Heatsink Item # 389581
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- Excellent Thermal Conductivity. Louver design helps the airflow movement into an "U-shape" aluminum fin to increase the path of thermal conductivity.
- Exceptional Heat Transfer E?ciency. Louver fin breaks the thermal boundary layer to increase heat exchange rate.
- Superior Contact. H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spot.
- Compatibility. Slim heat sink tower design increases RAM installation flexibility. ?Higher Durability. S.N.T.C (Super Nano Thermal Conductive) coating protects heat sink to avoid oxidation, keeps excellent heat transfer e?ciency and extends the life expectancy of the cooler.
- Patented APS control. Intelligent APS (Adjustable Peak Speed) control of the cooling fan directly provides 3 peak RPM selections for user preferences.
- BOL Bearing. Barometric Oilless (BOL) Bearing for long life span and silent spinning.
- Characteristics. Black or White colors are available. ?Silence with High Performance. Sophisticated fin gap calculation leads the ultra balancing between fan speed and heat transfer e?ciency.
- Easy Installation. All-in-one bracket for both latest Intel® and AMD® sockets.
|Air Flow||1 x 112 CFM|
|construction||Copper Heat Pipe; Aluminum Fin|
|fan diameter||1 x 120 mm|
|manufacturer||LEPA TECHNOLOGY CORPORATION|
|number of fans||1|
|power connector||4-pin PWM|
|warranty length||1-year limited|